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Empowering chip manufacturing with fluorine materials! HOCSIEN welcomes you to the event with our full matrix of electronic fluorinated fluids and fluorochemicals.


HOSCIEN
2026 IICIE International Integrated Circuit Innovation Expo
Full Fluorine Material Matrix · Grand Debut
Booth No.: 16D78
TIME
September 9-11, 2026
VENUE
Shenzhen World Exhibition & Convention Center (Bao'an)
BOOTH
Hall 16 · 16D78
About HOSCIEN
HOSCIEN Technology (Tianjin) Co., Ltd. was founded in 2014, specializing in fluorine fine chemicals. As a National High-tech Enterprise and a Specialized & Sophisticated Enterprise, the company has built an industrial layout of "Tianjin R&D, Jiangshan Production, Global Reach", established an Industry-University-Research Cooperation Platform with Tianjin University of Science and Technology, and holds 59 patents. Our products cover electronic fluorinated fluids, moisture-proof coatings, fluorine release agents, easy-to-clean coatings, and dry film lubricants, widely used in chip manufacturing, advanced packaging, semiconductor equipment, and optical communications.
National High-tech Enterprise Specialized & Sophisticated 59 Patents Industry-University-Research
2026 Jiangshan Production Base
Capacity and Quality Reach New Heights
RMB 360MInvestment
80 muSite Area
30,000 ㎡Building Area
8,000 t/yrTrifluoro Intermediates
3,000 t/yrElectronic Grade Fluids
Milestones
 
2014
HOSCIEN Technology (Tianjin) Co., Ltd. was founded, focusing on fluorine fine chemicals and embarking on the R&D journey of electronic-grade fluorine materials.
 
Technology Deepening
Continuous R&D based on the Tianjin R&D Center, established an Industry-University-Research Cooperation Platform with Tianjin University of Science and Technology, accumulated 59 patents, and was successively awarded National High-tech Enterprise and Specialized & Sophisticated Enterprise.
 
Product Expansion
Starting from electronic fluorinated fluids, gradually built a complete product matrix including electronic moisture-proof coatings, fluorine release agents, easy-to-clean coatings, and dry film lubricants, covering the entire semiconductor manufacturing and packaging testing process.
 
2026
Invested RMB 360 million to build the 80-mu Jiangshan Production Base, with a building area of 30,000 ㎡ and an annual production capacity of 8,000 tons of trifluoro series intermediates and 3,000 tons of electronic-grade fluorinated fluids, taking capacity and quality to new heights.
Highlight Products
01 Electronic Fluorinated Fluid
Zero ODP Non-flammable Excellent Insulation SGS Certified
HOSCIEN ES and HT series new-generation eco-friendly fluorinated solvents, featuring zero ODP, non-flammability with no flash point, and excellent electrical insulation, with a boiling range of 49~165℃. They have passed SGS RoHS and halogen tests. Suitable for semiconductor precision cleaning, etching process temperature control, immersion cooling, fluororesin dissolution, and precision leak detection — a long-term stable alternative to ODS cleaning agents.
Other Applications: Widely used in electronics manufacturing (PCB/precision component cleaning), data centers (server immersion cooling), aerospace (precision instrument leak detection), new energy vehicles (battery cooling), and other fields.
Application Fields
Chip Mfg. Advanced Pkg. Etching Ctrl Immersion Cool Electronics Data Centers NEV Aerospace
02 Electronic Moisture-proof Coating
Film 1~10μm WCA ≥110° Fast Curing UV Visible
Based on fluororesin with a film thickness of only 1~10μm, water contact angle ≥110°, surface resistance >10¹⁶Ω, and dielectric constant of 1.8. Fast curing at room temperature, UV-visible for quality inspection, flexible application by spraying/dipping/dropping. Specially designed to provide nano-level waterproof, moisture-proof, and electrolyte corrosion-resistant protection for PCBA, wafer-level packaging (WLP/Fan-out), advanced packaging (2.5D/3D/SiP/Flip-chip), power devices (IGBT/SiC/GaN), and MEMS sensors.
Other Applications: Comprehensively covers automotive electronics (ECU/ADAS/BMS), consumer electronics (smartphones/wearables/TWS earphones), 5G communications (base station boards/optical modules), industrial control (PLC/servo drives), new energy (PV inverters/energy storage BMS/charging piles), aerospace, and outdoor equipment.
Application Fields
Advanced Pkg. Auto Elec. Power Devices MEMS/Sensors Consumer Elec. 5G Comms. Industrial Ctrl New Energy
03 Fluorine Surface Treatment Agent
Dual-mode Release Film 0.01~0.1μm Surface E. >115° Non-migration
Adopts a "surface peeling + interlayer peeling" dual-mode release mechanism with a film thickness of only 0.01~0.1μm, much thinner than traditional silicone and wax release agents. Surface energy after curing >115°, with non-migration coating that does not contaminate molded parts. One application achieves long-term continuous release. Covers 82XX, HC-55XX, and FRC three major series. Suitable for semiconductor packaging molding (EMC), wafer-level packaging (WLP/Fan-out), flip-chip underfill, LED packaging, and SMT screen printing, effectively solving mold contamination and electrical conduction issues.
Other Applications: Mainly used for mold release of plastic and electronic components. Widely used in Tape&Reel carrier tapes, LCD light guide plates, precision injection molding, and release of LSR (liquid silicone rubber), TPU, TPE and other materials. Non-migration, non-contamination, ensuring clean surface and electrical performance.
Application Fields
Semiconductor Pkg. Wafer-level Pkg. LED Pkg. SMT Printing Precision Injection Tape&Reel LCD LGP LSR/TPU/TPE
04 Easy-to-Clean Coating
WCA >119° COF 0.026 10,000 Cycles PFAS Compliant
Achieves dual hydrophobic and oleophobic effects with extremely low surface tension — water contact angle >119°, dynamic friction coefficient as low as 0.026. Combines high transparency, excellent abrasion resistance (up to 10,000 cycles), and UV durability. Has passed SGS RoHS and PFAS compliance certification. Covers 8222DM, 8265D, 8260H, and AG/AR custom models. Suitable for anti-fouling protection of lithography machine optical windows, semiconductor inspection equipment (AOI) lenses, wafer inspection optical windows, and optical communication devices, ensuring long-term stable operation of precision optical systems.
Other Applications: Comprehensively covers optical lenses (smartphone/vehicle/security/AR-VR cameras), display panels (OLED/Micro-LED/vehicle displays/flexible screens), automotive (rearview mirrors/windows/HUD), consumer electronics (phone/tablet/laptop screens), home appliances (range hoods/TV panels), and PV panel anti-fouling.
Application Fields
Lithography Semiconductor Insp. Optical Lenses Optical Comms. Display Panels Auto Optics Consumer Elec. Home Appliances
05 Dry Film Lubricant
Perfluororesin COF 0.06 Vacuum Stable No Outgassing
Composed of perfluororesin and dispersion solvent, forming a clean dry lubricating film after coating, specially designed for precision equipment and optical mechanisms. The friction coefficient between POM and steel is as low as 0.06, persistently stable in vacuum and cleanroom environments, with no outgassing, no dust absorption, and no contamination of optical surfaces. Ready to use by brushing or dropping. Suitable for clean lubrication of lithography machine wafer transfer rails, etching/deposition equipment vacuum robots, bonder/probe station precision motion platforms, wafer dicing saw rails, and semiconductor packaging equipment precision sliding parts, meeting vacuum and cleanroom stringent requirements.
Other Applications: Widely used in precision optics (lens zoom/focus mechanisms/microscopes), optical communications (fiber alignment stages/optical module adjustment), automotive (seat rails/sunroof rails/rearview mirror adjustment), consumer electronics (laptop hinges/camera lens retraction/printer rails), industrial automation (precision machine tools/robot joints), and aerospace precision mechanisms.
Application Fields
Lithography Etch/Deposit Bonder/Probe Precision Optics Optical Comms. Auto Parts Consumer Elec. Industrial Auto.
Booth Information
HOSCIEN Booth Details
Hall
Hall 16
Booth No.
16D78
Date
Sep 9-11, 2026
HOSCIEN booth is located at Hall 16, 16D78 with a prominent location. We welcome all guests to visit and exchange ideas.
Meet in Shenzhen · Shape the Future
We sincerely invite you to visit our booth
to discuss innovation trends of fluorine materials in semiconductor and electronics manufacturing
and explore new opportunities for collaborative industry development.
TimeSeptember 9-11, 2026
VenueShenzhen World Exhibition & Convention Center (Bao'an)
BoothHall 16 · Booth 16D78
One QR Code for Three Expos · Scan to Pre-register in Advance
HOSCIEN Technology (Tianjin) Co., Ltd.
HOSCIEN