NEWS CENTER
HOSCIEN
22
2025
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08
The AI Computing Revolution Under the Dual-Carbon Goal: HOSCIEN Fluorinated Fluids Enter the Ten-Billion-Yuan Liquid Cooling Server Market
Industry Trends——Liquid Cooling Heat Dissipation Becomes a Focal Point
AI Computing Surge Drives Heat Dissipation Revolution
NVIDIA’s B-series released in 2024 boasts a single cabinet power of up to 130-250 kW. The upcoming Rubin series chips will further increase cabinet power consumption to over 1000 kW, pushing traditional air cooling to its thermal limits. Liquid cooling technology, with its high thermal conductivity and 40% reduction in energy consumption, has become essential.
Dual-Carbon Policies Drive Large-Scale Adoption of Liquid Cooling
Policies require data centers to reduce PUE to below 1.25, spurring rapid growth in cold plate cooling (currently 50% of the market) and immersion liquid cooling (with an annual growth rate exceeding 30%). According to IDC predictions, China's liquid cooling server market will exceed ten billion yuan by 2025, with immersion cooling accounting for over 10%.
3M Exit Triggers Supply Chain Restructuring
Global fluorinated fluid giant 3M announced it will exit production of per- and polyfluoroalkyl substances (PFAS) by the end of 2025 and cease using PFAS in its product portfolio, officially opening a window for domestic alternatives.
About HOSCIEN
HOSCIEN has dedicated a decade to the development of electronic fluorinated fluids, establishing end-to-end capabilities from R&D to production. Its products comply with EU RoHS and non-toxic certifications, and its liquid cooling solutions, developed in collaboration with industry leaders, have been quietly deployed.
HOSCIEN offers a full range of environmentally friendly fluorinated fluids for liquid cooling scenarios, providing new options for the liquid cooling server market in the post-3M era with "zero ODP, low GWP, and non-flammability":
Preferred for Immersion Cooling:
ES-7200: Features low GWP, a boiling point of 76°C suitable for medium-temperature heat dissipation, compatibility with semiconductor temperature control scenarios, and material compatibility covering copper, stainless steel, EPDM, and other mainstream components.
ES-100: Designed for high-power-density scenarios, with a thermal conductivity of 102 mW/mK (three times that of traditional oils) and a dielectric strength of >40 KV, providing stable insulation protection for GPU clusters.
Key Additives for Cold Plate Systems:
ES-7100 (Methyl Nonafluoroisobutyl Ether) combines fluidity (viscosity 0.63 cP) with insulation (withstand voltage >25 KV), making it an ideal filling fluid for cooling pipelines.
ES-500: A dual-function solution for cleaning and cooling, featuring ultra-low viscosity (0.56 cP) and strong insulation (withstand voltage >25 KV). It efficiently removes impurities during system maintenance and can be reused as a cooling medium, reducing operational costs for cold plate systems.
Toxicological Safety and Compliance Advantages
All products pass acute inhalation (LC50 >1000 mg/L), oral (LD50 >5000 mg/kg), and skin irritation tests, comply with EU Directive 2011/65/EU, and are fully supported with MSDS certifications.
As the AI computing surge meets the constraints of dual-carbon policies, HOSCIEN leverages its environmentally friendly fluorinated fluids to establish a closed-loop triangular framework integrating "thermal management, energy efficiency optimization, and material safety." Capitalizing on the historic opportunity presented by 3M's exit, HOSCIEN is rapidly integrating into the supply chains of leading data centers, injecting green momentum into China’s liquid cooling revolution.
HOSCIEN TECH(TIANJIN)CO.,LTD.
Telephone:8622-2859-9761
Fax: 8622-2859-9762
Address: No.5 Juxing Road, Haihe Science Park, Jinnan District, Tianjin
Telephone:+81-(0)568-65-8079
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