NEWS CENTER
HOSCIEN
27
2026
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01
REIWA MATERIAL CO., LTD. Makes a Splash at the 40th NEPCON JAPAN, Showcasing Advanced Electronic Materials Technology
January 21-23, 2026 — The 40th NEPCON JAPAN, a highly influential exhibition in the Asian electronics manufacturing industry, was grandly held in Tokyo, Japan. HOSCIEN Tiancheng Technology's Japanese subsidiary, REIWA MATERIAL CO., LTD., made a significant appearance by bringing multiple core electronic materials and solutions to the exhibition. With solid technological expertise and a diverse product portfolio, the company garnered attention and recognition from professional visitors on-site.
As a professional enterprise deeply rooted in the field of electronic materials, REIWA MATERIAL adheres to the development vision of "creating value for customers with new technologies and new products." For this exhibition, the company focused on core scenarios such as semiconductor manufacturing and electronic substrate processing, presenting a series of targeted products and technologies:
Semiconductor & Precision Cleaning Category: Displayed semiconductor refrigerant solvents, hydrofluoroether (HFE)-based cleaning agents, and ultra-precision cleaning equipment for electronic substrates, helping customers achieve efficient and environmentally friendly process cleaning. Additionally, a non-hazardous waste HFE-based cleaning agent was introduced, balancing performance with environmental friendliness.
Electronic Substrate Protection & Functional Materials: Showcased conformal protective films for electronic substrates offering moisture resistance, waterproofing, and chemical corrosion resistance, as well as low-temperature flexible, low-resistance conductive pastes, providing crucial support for the reliability and stability of electronic components.
Surface Functional Coating Materials: Presented products such as light-blocking/anti-reflective coating agents and high-printability oil-repellent agents, meeting the high-end requirements of display devices and precision electronic components for surface performance optimization.
At the exhibition booth, REIWA MATERIAL engaged in in-depth exchanges with global electronics manufacturers and technical experts through clear product displays and professional technical explanations. Many visitors inquired in detail about the performance specifics and application scenarios of products like semiconductor refrigerant solvents and HFE-based cleaning agents, resulting in consistently high foot traffic. This participation not only served as a concentrated display of REIWA MATERIAL's technological strength but also represented a vital opportunity to connect with the global electronics industry ecosystem and deepen customer collaborations.
Mr. Michiaki Miyaji, President of REIWA MATERIAL CO., LTD., stated, "NEPCON JAPAN is an important communication platform for the electronics manufacturing industry. We hope that through this exhibition, more customers will learn about REIWA MATERIAL's technological innovation achievements. In the future, we will continue to focus on the upgrade needs of the electronics industry, empowering the development of global electronics manufacturing enterprises with more advanced materials and solutions."
Moving forward, REIWA MATERIAL will continue to leverage its technological accumulation and innovation capabilities to provide higher-quality products and services for the global electronics industry, driving the sector towards a stage of higher precision and greater sustainability.
HOSCIEN TECH(TIANJIN)CO.,LTD.
Telephone:8622-2859-9761
Fax: 8622-2859-9762
Address: No.5 Juxing Road, Haihe Science Park, Jinnan District, Tianjin
Telephone:+81-(0)568-65-8079
Address: GIMUCO·B,371-2,FujitsukaIwazaki,
Komaki-shi,Aichi, 485-0011,JAPAN
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