NEWS CENTER
HOSCIEN
10
2026
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09
Hoscien Debuts at 2026 IICIE International Integrated Circuit Innovation Expo Fluorine Materials Empowering Chip Manufacturing
From September 9 to 11, 2026, the IICIE International Integrated Circuit Innovation Expo was grandly held at Shenzhen World Exhibition & Convention Center (Bao'an). Co-located with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics Exhibition), the three expos connect the entire "Optics—Chips—Electronics" industry chain, creating an international exchange and cooperation platform for the semiconductor industry. Hoscien Technology (Tianjin) Co., Ltd. showcased its full matrix of fluorine-containing electronic materials at Hall 16, Booth 16D78, systematically presenting the diverse applications of fluorine materials in semiconductor and electronics manufacturing.
Three Expos United · A Grand Industry Event
The IICIE International Integrated Circuit Innovation Expo focuses on innovation across the entire integrated circuit industry chain. Co-located with CIOE and elexcon this year, the three expos cover a total exhibition area of 320,000 m², bringing together over 5,000 exhibitors. On the opening day, total visitors reached 36,424, with overall visitor volume up 110% year-on-year. Professional buyers from home and abroad gathered, and industry enthusiasm continued to rise.
320,000 m² Total Exhibition Area | 5,000+ Exhibitors | 36,424 Opening-day Visitors | +110% YoY Growth |
Grand Debut · Booth 16D78
Located at Hall 16, Booth 16D78, Hoscien's booth features a clean and elegant blue-and-white visual identity. The booth includes a product application display wall, an immersion liquid cooling dynamic demonstration unit, a sample experience area, and a business negotiation area—systematically presenting the diverse applications of fluorine materials in semiconductor precision cleaning, etching temperature control, immersion liquid cooling, advanced packaging protection, and surface treatment, attracting numerous professional visitors to stop, observe, and consult.
Full Product Matrix · Hard-core Launch
The booth showcased five major product series: Electronic Fluorinated Liquids, Electronic Moisture-proof Coatings, Fluorine-based Surface Treatment Agents, Easy-to-clean Coatings, and Dry Film Lubricants, covering the full workflow of semiconductor precision cleaning, etching temperature control, immersion liquid cooling, advanced packaging protection, and surface treatment—providing a one-stop fluorine material solution for chip manufacturing.
Among them, the Electronic Fluorinated Liquids series features zero ODP, non-flammable with no flash point, and excellent electrical insulation, and has passed SGS·RoHS certification. With a boiling range of 49–165°C, it can be widely applied in semiconductor etching temperature control, data center immersion liquid cooling, live cleaning, and battery thermal management. The immersion liquid cooling dynamic demonstration unit operated on-site, intuitively presenting the efficient performance of fluorinated liquids in data center thermal management.
In-depth Exchange · Exploring Chip Trends
Over the three days, the booth's technical team engaged in in-depth one-on-one discussions with domestic and overseas customers from fields including chip design, wafer manufacturing, packaging and testing, semiconductor equipment, data centers, and new energy—focusing on scenarios such as immersion liquid cooling, precision cleaning, PCBA moisture protection, packaging mold release, and optical easy-to-clean treatments. They precisely matched customer needs and explored new opportunities for fluorine materials to empower the semiconductor industry.
Meet in Shenzhen · Shape the Future Together
Through this exhibition, Hoscien demonstrated its deep accumulation in the semiconductor and electronics manufacturing fields with its full matrix of fluorine-containing electronic material products and professional technical services. Going forward, Hoscien will continue to deepen R&D and application innovation in fluorine materials, providing more efficient, safer, and more environmentally friendly material solutions for chip manufacturing.
The exhibition runs through September 11. Industry partners are welcome to visit Hall 16, Booth 16D78 at Shenzhen World Exhibition & Convention Center (Bao'an) for discussions, and to explore the future of fluorine materials empowering the semiconductor industry together.
Hall Hall 16 | Booth 16D78 | Date Sep 9–11 |
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